launch Claeys, T., Pissoort, D., Vanhee, F., Pluvier, K. (2021). EMC for RED. Invited by FHI Federatie van Technologie Branches. Presented at the RF Technology Event, Online.
launch Nawghane, C., Vandevelde, B., Labie, R., Allaert, B., Lauwaert, R., Vanhee, F., Pissoort, D., De Wolf, I., Mehner, J. (2018). Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board. In: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018, (1-8). ISBN: 9781538623596. doi: 10.1109/EuroSimE.2018.8369950
launch Sabuncuoglu, B., Vanhee, F., Willems, G., Vandevelde, B., Vandepitte, D. (2017). Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (12), 1-8.
launch Vanoost, D., Claeys, T., Degraeve, A., Vanhee, F., Pissoort, D. (2017). Dedicated Stripline Set-Up for the Characterization of the Shielding Effectiveness of Board-Level Shields. In: 2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE. Presented at the EMC Europe 2017., Angers, France, 04 Sep 2017-08 Sep 2017. doi: 10.1109/EMCEurope.2017.8094619
launch Pissoort, D., Claeys, T., Vanoost, D., Vanhee, F., Catrysse, J., Brull, C. (2017). Influence of Sample Shape and Size on the Shielding Effectiveness of EMI when Characterized with the Stripline Test Method. In: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI). Presented at the IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, Washington, 07 Aug 2017-11 Aug 2017. doi: 10.1109/ISEMC.2017.8077949
launch Vandevelde, B., Vanhee, F., Pissoort, D., Degrendele, L., De Baets, J., Allaert, B., Lauwaert, R., Zanon, F., Willems, G. (2017). Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. Microelectronics Reliability, 74, 131-135. doi: 10.1016/j.microrel.2017.04.008via repository
launch Degraeve, A., Claeys, T., Vanhee, F., Peuteman, J., Pissoort, D., Armstrong, K. (2016). Development of an EMC demonstration unit. In: Proceedings of the 2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE 2016, (422-427). Presented at the EMC EUROPE 2016, Wroclaw, Poland, 05 Sep 2016-09 Sep 2016.
launch Catrysse, J., Pissoort, D., Vanhee, F. (2016). Shielding effectiveness of planar materials: (semi)-standardized measurements from LF to μW. In: PROCEEDINGS OF 2016 ESA WORKSHOP ON AEROSPACE EMC (AEROSPACE EMC), (1-5). Presented at the ESA Workshop on Aerospace EMC (Aerospace EMC), Valencia: SPAIN, 23 May 2016-25 May 2016. NEW YORK. via repository
launch Vandevelde, B., Vanhee, F., Pissoort, D., Degrendele, L., De Baets, J., Allaert, B., Lauwaert, R., Labie, R., Willems, G. (2016). Four-point bending cycling as alternative for Thermal cycling solder fatigue testing. In: 2016 17TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), (1-5). Presented at the International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Montpellier: FRANCE, 18 Apr 2016-20 Apr 2016. NEW YORK. via repository
launch Pissoort, D., Catrysse, J., Claeys, T., Vanhee, F., Boesman, B., Brull, C. (2015). Towards a stripline setup to characterise the effects of corrosion and ageing on the shielding effectiveness of EMI gaskets. In: Proceedings of the 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), (7-12). Presented at the 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden Germany, 16 Aug 2015-22 Aug 2015. via repository
launch Claeys, T., Pissoort, D., Vanhee, F., Pluvier, K. (2021). EMC for RED. Invited by FHI Federatie van Technologie Branches. Presented at the RF Technology Event, Online.
launch Nawghane, C., Vandevelde, B., Labie, R., Allaert, B., Lauwaert, R., Vanhee, F., Pissoort, D., De Wolf, I., Mehner, J. (2018). Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board. In: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018, (1-8). ISBN: 9781538623596. doi: 10.1109/EuroSimE.2018.8369950
launch Sabuncuoglu, B., Vanhee, F., Willems, G., Vandevelde, B., Vandepitte, D. (2017). Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (12), 1-8.
launch Vanoost, D., Claeys, T., Degraeve, A., Vanhee, F., Pissoort, D. (2017). Dedicated Stripline Set-Up for the Characterization of the Shielding Effectiveness of Board-Level Shields. In: 2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE. Presented at the EMC Europe 2017., Angers, France, 04 Sep 2017-08 Sep 2017. doi: 10.1109/EMCEurope.2017.8094619
launch Pissoort, D., Claeys, T., Vanoost, D., Vanhee, F., Catrysse, J., Brull, C. (2017). Influence of Sample Shape and Size on the Shielding Effectiveness of EMI when Characterized with the Stripline Test Method. In: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI). Presented at the IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, Washington, 07 Aug 2017-11 Aug 2017. doi: 10.1109/ISEMC.2017.8077949
launch Vandevelde, B., Vanhee, F., Pissoort, D., Degrendele, L., De Baets, J., Allaert, B., Lauwaert, R., Zanon, F., Willems, G. (2017). Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. Microelectronics Reliability, 74, 131-135. doi: 10.1016/j.microrel.2017.04.008via repository
launch Degraeve, A., Claeys, T., Vanhee, F., Peuteman, J., Pissoort, D., Armstrong, K. (2016). Development of an EMC demonstration unit. In: Proceedings of the 2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE 2016, (422-427). Presented at the EMC EUROPE 2016, Wroclaw, Poland, 05 Sep 2016-09 Sep 2016.
launch Catrysse, J., Pissoort, D., Vanhee, F. (2016). Shielding effectiveness of planar materials: (semi)-standardized measurements from LF to μW. In: PROCEEDINGS OF 2016 ESA WORKSHOP ON AEROSPACE EMC (AEROSPACE EMC), (1-5). Presented at the ESA Workshop on Aerospace EMC (Aerospace EMC), Valencia: SPAIN, 23 May 2016-25 May 2016. NEW YORK. via repository
launch Vandevelde, B., Vanhee, F., Pissoort, D., Degrendele, L., De Baets, J., Allaert, B., Lauwaert, R., Labie, R., Willems, G. (2016). Four-point bending cycling as alternative for Thermal cycling solder fatigue testing. In: 2016 17TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), (1-5). Presented at the International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Montpellier: FRANCE, 18 Apr 2016-20 Apr 2016. NEW YORK. via repository
launch Pissoort, D., Catrysse, J., Claeys, T., Vanhee, F., Boesman, B., Brull, C. (2015). Towards a stripline setup to characterise the effects of corrosion and ageing on the shielding effectiveness of EMI gaskets. In: Proceedings of the 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), (7-12). Presented at the 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), Dresden Germany, 16 Aug 2015-22 Aug 2015. via repository